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SR1206MR-7T1RL Datasheet(PDF) 10 Page - YAGEO Corporation |
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SR1206MR-7T1RL Datasheet(HTML) 10 Page - YAGEO Corporation |
10 / 12 page SERIES YC/TC 102 to 358 Chip Resistor Surface Mount www.yageo.com Feb. 16, 2017 V.5 Product specification 10 12 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Operational Life/ Endurance MIL-STD-202G-method 108A IEC 60115-1 4.25.1 JIS C 5202-7.10 1,000 hours at 70± 5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ± (2%+0.05 Ω) <100 mΩ for Jumper High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202G-method 108A IEC 60115-1 4.25.3 JIS C 5202-7.11 1,000 hours at maximum operating temperature depending on specification, unpowered No direct impingement of forced air to the parts Tolerances: 125± 3 °C ± (1%+0.05 Ω) <50 mΩ for Jumper Moisture Resistance MIL-STD-202G-method 106F IEC 60115-1 4.24.2 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Measurement at 24± 2 hours after test conclusion ± (2%+0.05 Ω) <100 mΩ for Jumper Thermal Shock MIL-STD-202G-method 107G -55/+125 °C Note: Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ± (1%+0.05 Ω) <50 mΩ for Jumper Short Time Overload MIL-R-55342D-para 4.7.5 IEC60115-1 4.13 2.5 times RCWV or maximum overload voltage whichever is less for 5 sec at room temperature ± (2%+0.05 Ω) <50 mΩ for Jumper No visible damage Board Flex/ Bending IEC60115-1 4.33 Device mounted on PCB test board as described, only 1 board bending required 3 mm bending Bending time: 60± 5 seconds Ohmic value checked during bending ± (1%+0.05 Ω) <50 mΩ for Jumper No visible damage Table 4 Test condition, procedure and requirements |
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