OPA333, OPA2333

SBOS351E – MARCH 2006 – REVISED DECEMBER 2015

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6.4 Thermal Information: OPA333

OPA333

D (SOIC)

DBV (SOT)

DCK (SC70)

UNIT

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

140.1

220.8

298.4

°C/W

89.8

97.5

65.4

°C/W

Junction-to-board thermal resistance

80.6

61.7

97.1

°C/W

Junction-to-top characterization parameter

28.7

7.6

0.8

°C/W

Junction-to-board characterization parameter

80.1

61.1

95.5

°C/W

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information: OPA2333

OPA2333

D (SOIC)

DGK (VSSOP)

DRB (VSON)

UNIT

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

124.0

180.3

46.7

°C/W

73.7

48.1

26.3

°C/W

Junction-to-board thermal resistance

64.4

100.9

22.2

°C/W

Junction-to-top characterization parameter

18.0

2.4

1.6

°C/W

Junction-to-board characterization parameter

63.9

99.3

22.3

°C/W

—

—

10.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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