SN65LBC184, SN75LBC184

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SLLS236I – OCTOBER 1996 – REVISED JUNE 2015

5 Pin Configuration and Functions

D Package, P Package

8-Pin SOIC, 8-Pin PDIP

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

A

6

Bus input/output

Driver output or receiver input (complementary to B)

B

7

Bus input/output

Driver output or receiver input (complementary to A)

D

4

Digital input

Driver data input

DE

3

Digital input

Active-HIGH driver enable

GND

5

Reference potential

Local device ground

R

1

Digital output

Receiver data output

RE

2

Digital input

Active-LOW receiver enable

8

Supply

4.75-V to 5.25-V supply

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

7

V

Continuous voltage range at any bus terminal

–15

15

V

Data input/output voltage

–0.3

7

V

Receiver output current

–20

20

mA

Internally Limited

Storage temperature

160

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential input/output bus voltage, are with respect to network ground terminal.

(3)

The driver shuts down at a junction temperature of approximately 160°C. To operate below this temperature, see the Dissipation

Ratings.

6.2 ESD Ratings

VALUE

UNIT

A, B, GND

±15000

Human body model (HBM), per ANSI/ESDA/JEDEC

All pins

±3000

Contact discharge (IEC61000-4-2)

±30000

Electrostatic

V

discharge

Air discharge (IEC61000-4-2)

±15000

All pins (Class 3A)

±8000

All pins (Class 3B)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

GND and bus pin ESD protection is beyond readily available test equipment capabilities for IEC 61000-4-2, EIA/JEDEC test method

A114-A and MIL-STD-883C method 3015. Ratings listed are limits of test equipment; device performance exceeds these limits.

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