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OPT3001IDNPRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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OPT3001IDNPRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 43 page 4 OPT3001-Q1 SBOS853 – MARCH 2017 www.ti.com Product Folder Links: OPT3001-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy. 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Voltage VDD to GND –0.5 6 V SDA, SCL, INT, and ADDR to GND –0.5 6 V Current into any pin 10 mA Temperature Junction 150 °C Storage, Tstg –65 150(2) °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±500 6.3 Recommended Operating Conditions MIN NOM MAX UNIT Operating temperature –40 85 °C Operating power-supply voltage 1.6 3.6 V (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) OPT3001-Q1 UNIT DNP (USON) 6 PINS RθJA Junction-to-ambient thermal resistance 71.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 45.7 °C/W RθJB Junction-to-board thermal resistance 42.2 °C/W ψJT Junction-to-top characterization parameter 2.4 °C/W ψJB Junction-to-board characterization parameter 42.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 17.0 °C/W |
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