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ISO1540 Datasheet(PDF) 6 Page - Texas Instruments |
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ISO1540 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 34 page 6 ISO1540, ISO1541 SLLSEB6D – JULY 2012 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: ISO1540 ISO1541 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Bus pins ±8000 V All pins ±4000 Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1500 Machine Model JEDEC JESD22-A115-A, all pins ±200 (1) This represents the maximum frequency with the maximum bus load (C) and the maximum current sink (IO). If the system has less bus capacitance, then higher frequencies can be achieved. 6.3 Recommended Operating Conditions MIN MAX UNIT VCC1, VCC2 Supply voltage 3 5.5 V VSDA1, VSCL1 Input and output signal voltages, side 1 0 VCC1 V VSDA2, VSCL2 Input and output signal voltages, side 2 0 VCC2 V VIL1 Low-level input voltage, side 1 0 0.5 V VIH1 High-level input voltage, side 1 0.7 × VCC1 VCC1 V VIL2 Low-level input voltage, side 2 0 0.3 × VCC2 V VIH2 High-level input voltage, side 2 0.7 × VCC2 VCC2 V IOL1 Output current, side 1 0.5 3.5 mA IOL2 Output current, side 2 0.5 35 mA C1 Capacitive load, side 1 40 pF C2 Capacitive load, side 2 400 pF fMAX Operating frequency(1) 1 MHz TA Ambient temperature –40 125 °C TJ Junction temperature –40 136 °C TSD Thermal shutdown 139 171 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). 6.4 Thermal Information THERMAL METRIC(1) ISO154x UNIT D (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 114.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 69.6 °C/W RθJB Junction-to-board thermal resistance 55.3 °C/W ψJT Junction-to-top characterization parameter 27.2 °C/W ψJB Junction-to-board characterization parameter 54.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W 6.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150 °C, C1 = 40 pF, C2 = 400 pF; Input a 1-MHz 50% duty cycle clock signal 85 mW PD1 Maximum power dissipation (side-1) 34 mW PD2 Maximum power dissipation (side-2) 51 mW |
Similar Part No. - ISO1540_17 |
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Similar Description - ISO1540_17 |
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