6

ISO1540, ISO1541

SLLSEB6D – JULY 2012 – REVISED DECEMBER 2016

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Copyright © 2012–2016, Texas Instruments Incorporated

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

Bus pins

±8000

V

All pins

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

Machine Model JEDEC JESD22-A115-A, all pins

±200

(1)

capacitance, then higher frequencies can be achieved.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC1, VCC2

Supply voltage

3

5.5

V

Input and output signal voltages, side 1

0

VCC1

V

Input and output signal voltages, side 2

0

VCC2

V

Low-level input voltage, side 1

0

0.5

V

High-level input voltage, side 1

0.7 × VCC1

VCC1

V

Low-level input voltage, side 2

0

0.3 × VCC2

V

High-level input voltage, side 2

0.7 × VCC2

VCC2

V

Output current, side 1

0.5

3.5

mA

Output current, side 2

0.5

35

mA

C1

Capacitive load, side 1

40

pF

C2

Capacitive load, side 2

400

pF

1

MHz

Ambient temperature

–40

125

°C

Junction temperature

–40

136

°C

Thermal shutdown

139

171

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.4 Thermal Information

ISO154x

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

114.6

°C/W

Junction-to-case (top) thermal resistance

69.6

°C/W

Junction-to-board thermal resistance

55.3

°C/W

Junction-to-top characterization parameter

27.2

°C/W

Junction-to-board characterization parameter

54.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation (both sides)

40 pF, C2 = 400 pF;

Input a 1-MHz 50% duty cycle clock signal

85

mW

Maximum power dissipation (side-1)

34

mW

Maximum power dissipation (side-2)

51

mW