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RC0402DR-7N9K76L Datasheet(PDF) 9 Page - YAGEO Corporation |
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RC0402DR-7N9K76L Datasheet(HTML) 9 Page - YAGEO Corporation |
9 / 10 page Chip Resistor Surface Mount www.yageo.com Feb. 17, 2017 V.5 Product specification 9 10 SERIES RC_L 0075 to 2512 Thermal Shock MIL-STD-202 Method 107G -55/+125°C Note Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air - Air 0075/01005: ± (1% +50mΩ) < 50mΩf or jumper Others: ± (0.5%+50mΩ) for B/D/F tol ± (1%+50mΩ) for J tol <50mR for jumper Short Time Overload IEC 60115-1 4.13 2.5 times RCWV or maximum overload voltage which is less for 5 seconds at room temperature 0075/01005: ± (2% +50mΩ) < 50mΩf or jumper Others: ± (1%+50mΩ) for B/D/F tol ± (2%+50mΩ) for J tol <50mR for jumper No visible damage Board Flex/ Bending IEC 60115-1 4.33 Device mounted or as described only 1 board bending required bending time: 60± 5 seconds 0075/0100/0201/0402:5mm; 0603/0805:3mm; 1206 and above:2mm 0075/01005: ± (1% +50mΩ) < 50mΩf or jumper Others: ± (1%+50mΩ) for B/D/F/J Tol <50mR for jumper No visible damage Solderability - Wetting J-STD-002 test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds W ell tinned (>95% covered) No visible damage -Leaching J-STD-002 test D Leadfree solder ,260°C, 30 seconds immersion time No visible damage -Resistance to Soldering Heat MIL-STD-202 Method 210F IEC 60115-1 4.18 Condition B, no pre-heat of samples Leadfree solder, 260 °C ± 5°C, 10 ± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol 0075: ± (3%+50mΩ) <50mΩ for jumper 01005: ± (1% +50mΩ) < 50mΩf or jumper Others: ±(0.5% +50mΩ ) for B/D/F tol.±(1% +50mΩ ) for J tol. <50mR for jumper No visible damage |
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