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OPT202 Datasheet(PDF) 4 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
Part No. OPT202
Description  PHOTODIODE WITH ON-CHIP AMPLIFIER
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Maker  BURR-BROWN [Burr-Brown (TI)]
Homepage  http://www.burr-brown.com
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 4 page
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®
OPT202
4
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATIONS
Top View
DIP
V+
–In
V–
1M
Ω Feedback
Common
NC
NC
Output
1
2
3
4
8
7
6
5
(1)
NOTE: (1) Photodiode location.
Top View
SIP
Common
V+
V–
1M
Ω Feedback
Output
1
2
3
4
5
(1)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage ...................................................................................
±18V
Input Voltage Range (Common Pin) ....................................................
±V
S
Output Short-Circuit (to ground) ............................................... Continuous
Operating Temperature: P, W ........................................... –25
°C to +85°C
G ............................................. –55
°C to +125°C
Storage Temperature:
P, W ........................................... –25
°C to +85°C
G ............................................. –55
°C to +125°C
Junction Temperature: P, W .......................................................... +85
°C
G ............................................................. +150
°C
Lead Temperature (soldering, 10s) ................................................ +300
°C
(Vapor-Phase Soldering Not Recommended on Plastic Packages)
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
OPT202P
8-Pin Plastic DIP
006-1
OPT202W
5-Pin Plastic SIP
321
OPT202G
8-Pin Ceramic DIP
161-1
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
MOISTURE SENSITIVITY
AND SOLDERING
Clear plastic does not contain the structural-enhancing fillers
used in black plastic molding compound. As a result, clear
plastic is more sensitive to environmental stress than black
plastic. This can cause difficulties if devices have been stored
in high humidity prior to soldering. The rapid heating during
soldering can stress wire bonds and cause failures. Prior to
soldering, it is recommended that plastic devices be baked-out
at 85
°C for 24 hours.
The fire-retardant fillers used in black plastic are not compat-
ible with clear molding compound. The OPT202 plastic
packages cannot meet flammability test, UL-94.




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