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R475I21000002M Datasheet(PDF) 8 Page - Kemet Corporation |
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R475I21000002M Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 14 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3008_R47_X2_520 • 6/9/2016 8 Metallized Polypropylene Film EMI Suppression Capacitors R47 Series, Class X2, 520 VAC, 85ºC (Automotive Grade) Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. The soldering iron tip temperature should be set at350°C(+10°Cmaximum)withthesoldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 8 Soldering time (sec) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenewalloys.Asaresult,theheatstress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene capacitorsareespeciallysensitivetoheat(themeltingpointofpolypropyleneis160–170ºC).Wavesolderingcanbedestructive,especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1. Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe recommended limits may result to degradation or permanent damage to the capacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through- holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle. Dielectric Film Material Maximum Preheat Temperature Maximum Peak Soldering Temperature Capacitor Pitch ≤10mm Capacitor Pitch = 15 mm Capacitor Pitch > 15 mm Capacitor Pitch ≤15mm Capacitor Pitch > 15 mm Polyester 130°C 130°C 130°C 270°C 270°C Polypropylene 100°C 110°C 130°C 260°C 270°C Polyphenylene Sulphide 150°C 150°C 160°C 270°C 270°C Wave Soldering Recommendations Figure 1 0 50 100 150 200 250 300 0 40 80 120 160 200 240 Time (s) ca 2°C/s ca 3.5°C/s typical ca 5°C/s Cooling 2+3s max 115°C max Tpreheat ΔT <150°C 100°C Preheating Typical First wave Second wave 260°C |
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