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F3008_R47_X2_520 • 6/9/2016 11

Metallized Polypropylene Film EMI Suppression Capacitors

R47 Series, Class X2, 520 VAC, 85ºC (Automotive Grade)

Lead Taping & Packaging (IEC 60286–2)

Taping Specification

Description

Symbol

Dimensions (mm)

Lead Space

Tol.

10

15

22.5

27.5

Fig. 1

Fig. 2

Fig. 3

Fig. 3

Lead wire diameter

d

0.6

0.6-0.8

0.8

0.8

±0.05

Taping lead space

P

25.4

25.4

38.1

38.1

±1

Feedholeleadspace*

P

0

12.7

12.7

12.7

12.7

±0.2**

Centering of the lead wire

P

1

7.7

5.2

7.8

5.3

±0.7

Centering of the body

P

2

12.7

12.7

19.05

19.05

±1.3

Leadspacing(pitch)***

F

10

15

22.5

27.5

+0.6/-0.1

Component alignment

∆h

0

0

0

0

±2

Height of component

from tape center

18.5

18.5

18.5

18.5

±0.5

Carrier tape width

W

18

18

18

18

+1/-0.5

Hold down tape width

W

0

9

10

10

10

Minimum

Hole position

W

1

9

9

9

9

±0.5

Hold down tape position

W

2

3

3

3

3

Maximum

Feed hole diameter

D

0

4

4

4

4

±0.2

Tape thickness

t

0.7

0.7

0.7

0.7

±0.2

* Also available in 15 mm.

** Max 1 mm on 20 lead spaces.

*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request.

P

F

h

h

ød

t

P

Figure 1

Lead Spacing 10 mm

Figure 2

Lead Spacing 15 mm

Figure 3

Lead Spacing 22.5 – 27.5 mm