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NTF2955 Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTF2955
Description  Power MOSFET
Download  6 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTF2955 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 1
1
Publication Order Number:
NTF2955/D
NTF2955
Power MOSFET
−60 V, −2.6 A, Single P−Channel SOT−223
Features
TMOS7 Design for low R
DS(on)
Withstands High Energy in Avalanche and Commutation Modes
Applications
Power Supplies
PWM Motor Control
Converters
Power Management
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
−60
V
Gate−to−Source Voltage
VGS
±20
V
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
ID
−2.6
A
Current (Note 1)
State
TA = 85°C
−2.0
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
PD
2.3
W
Continuous Drain
Current (Note 2)
Steady
State
TA = 25°C
ID
−1.7
A
Current (Note 2)
State
TA = 85°C
−1.3
Power Dissipation
(Note 2)
TA = 25°C
PD
1.0
W
Pulsed Drain Current
tp = 10
ms
IDM
−10.4
A
Operating Junction and Storage Temperature
TJ,
TSTG
−55 to
175
°C
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 25 V, VG = 10 V, IPK = 6.7 A,
L = 10 mH, RG = 25 W)
EAS
225
mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
Junction−to−Tab (Drain) − Steady State (Note 2)
RqJC
14
°C/W
Junction−to−Ambient − Steady State (Note 1)
RqJA
65
Junction−to−Ambient − Steady State (Note 2)
RqJA
150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1 in. pad size
(Cu. area = 1.127 in2 [1 oz] including traces)
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu. area = 0.341 in2)
D
S
G
P−Channel
http://onsemi.com
−60 V
145 m
W @ −10 V
RDS(on) TYP
−2.6 A
ID MAX
V(BR)DSS
1
2
3
4
Device
Package
Shipping
ORDERING INFORMATION
NTF2955T1
SOT−223
1000/Tape & Reel
SOT−223
CASE 318E
STYLE 3
LWW
MARKING
DIAGRAM
2955
2955
= Device Code
L
= Location Code
WW
= Work Week
PIN ASSIGNMENT
3
2
1
4
Gate
Drain Source
Drain
NTF2955T3
SOT−223
4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.


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