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NTF2955 Datasheet(PDF) 1 Page - ON Semiconductor |
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NTF2955 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page © Semiconductor Components Industries, LLC, 2004 August, 2004 − Rev. 1 1 Publication Order Number: NTF2955/D NTF2955 Power MOSFET −60 V, −2.6 A, Single P−Channel SOT−223 Features • TMOS7 Design for low R DS(on) • Withstands High Energy in Avalanche and Commutation Modes Applications • Power Supplies • PWM Motor Control • Converters • Power Management MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS −60 V Gate−to−Source Voltage VGS ±20 V Continuous Drain Current (Note 1) Steady State TA = 25°C ID −2.6 A Current (Note 1) State TA = 85°C −2.0 Power Dissipation (Note 1) Steady State TA = 25°C PD 2.3 W Continuous Drain Current (Note 2) Steady State TA = 25°C ID −1.7 A Current (Note 2) State TA = 85°C −1.3 Power Dissipation (Note 2) TA = 25°C PD 1.0 W Pulsed Drain Current tp = 10 ms IDM −10.4 A Operating Junction and Storage Temperature TJ, TSTG −55 to 175 °C Single Pulse Drain−to−Source Avalanche Energy (VDD = 25 V, VG = 10 V, IPK = 6.7 A, L = 10 mH, RG = 25 W) EAS 225 mJ Lead Temperature for Soldering Purposes (1/8” from case for 10 s) TL 260 °C THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit Junction−to−Tab (Drain) − Steady State (Note 2) RqJC 14 °C/W Junction−to−Ambient − Steady State (Note 1) RqJA 65 Junction−to−Ambient − Steady State (Note 2) RqJA 150 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. When surface mounted to an FR4 board using 1 in. pad size (Cu. area = 1.127 in2 [1 oz] including traces) 2. When surface mounted to an FR4 board using the minimum recommended pad size (Cu. area = 0.341 in2) D S G P−Channel http://onsemi.com −60 V 145 m W @ −10 V RDS(on) TYP −2.6 A ID MAX V(BR)DSS 1 2 3 4 Device Package Shipping† ORDERING INFORMATION NTF2955T1 SOT−223 1000/Tape & Reel SOT−223 CASE 318E STYLE 3 LWW MARKING DIAGRAM 2955 2955 = Device Code L = Location Code WW = Work Week PIN ASSIGNMENT 3 2 1 4 Gate Drain Source Drain NTF2955T3 SOT−223 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. |
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