2

5

3

4

Y

1

A

GND

N.C.

V

CC

3

SN74LVC1G07-Q1

www.ti.com

SCES826A – MARCH 2011 – REVISED FEBRUARY 2017

Product Folder Links: SN74LVC1G07-Q1

Submit Documentation Feedback

Copyright © 2011–2017, Texas Instruments Incorporated

5 Pin Configuration and Functions

DBV or DCK Package

5-Pin SOT-23 or SC70

Top View

N.C. – No internal connection

See mechanical drawings for dimensions.

Pin Functions

PIN

I/O

DESCRIPTION

NO.

SOT-23, SC70

1

N.C.

—

Not connected

2

A

I

Input

3

GND

P

Ground

4

Y

O

Output

5

P

Power Pin

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

6.5

V

–0.5

6.5

V

–0.5

6.5

V

–0.5

6.5

V

Input clamp current

–50

mA

Output clamp current

–50

mA

Continuous output current

±50

mA

±100

mA

Operating junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000