bq24100, bq24103, bq24103A, bq24104, bq24105

bq24108, bq24109, bq24113, bq24113A, bq24115

SLUS606P – JUNE 2004 – REVISED NOVEMBER 2015

www.ti.com

Pin Functions (continued)

PIN

bq24100,

bq24103,

I/O

DESCRIPTION

bq24113,

NAME

bq24108,

bq24103A

bq24105

bq24115

bq24113A

bq24109

bq24104

Charge status 2 (open-drain output). When the transistor turns on

STAT2

19

19

19

O

indicates charge is done. When it is off and with the condition of STAT1

indicates various charger conditions (See Table 1)

Temperature sense input. This input monitors its voltage against an

internal threshold to determine if charging is allowed. Use an NTC

TS

12

12

12

12

12

I

thermistor and a voltage divider powered from VTSB to develop this

voltage. (See Figure 4)

Timer and termination control. Connect a capacitor from this node to GND

TTC

7

7

7

I

to set the bqSWITCHER™ timer. When this input is low, the timer and

termination detection are disabled.

VCC

6

6

6

6

6

I

Analog device input. A 0.1

μF capacitor to VSS is required.

VSS

10

10

10

10

10

Analog ground input

TS internal bias regulator voltage. Connect capacitor (with a value

VTSB

11

11

11

11

11

O

between a 0.1-

μF and 1-μF) between this output and VSS.

There is an internal electrical connection between the exposed thermal

pad and VSS. The exposed thermal pad must be connected to the same

Exposed

potential as the VSS pin on the printed circuit board. The power pad can

Thermal

Pad

Pad

Pad

Pad

Pad

Pad

ground plane may be used. VSS pin must be connected to ground at all

times.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage (with respect to

IN, VCC

20

V

STAT1, STAT2, PG, CE, CELLS, SNS, BAT

–0.3

20

V

OUT

–0.7

20

V

Input voltage (with respect to

CMODE, TS, TTC

7

V

VTSB

3.6

V

ISET1, ISET2

3.3

V

±1

V

Output sink

STAT1, STAT2, PG

10

mA

Output current (average)

OUT

2.2

A

–40

85

°C

–40

125

°C

Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds

300

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

±500

(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6

Submit Documentation Feedback

Copyright © 2004–2015, Texas Instruments Incorporated

Product Folder Links: bq24100 bq24103 bq24103A bq24104 bq24105 bq24108 bq24109 bq24113 bq24113A

bq24115