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RC0201FK-0797R6P Datasheet(PDF) 6 Page - YAGEO Corporation |
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RC0201FK-0797R6P Datasheet(HTML) 6 Page - YAGEO Corporation |
6 / 8 page Chip Resistor Surface Mount www.yageo.com Aug. 22, 2014 V.0 Product specification 6 8 SERIES RC_P 0100 to 2512 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 At +25/–55 °C and +25/+125 °C Refer to table 2 Formula: T.C.R= ) t t ( R R R 1 2 1 1 2 × 106 (ppm/°C) Where t1=+25 °C or specified room temperature t2=–55 °C or +125 °C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/ Endurance MIL-STD-202G Method 108A IEC 60115-1 4.25.1 At 70± 5℃ for 1,000 hours; RCWV applied for 1.5 hours on and 0.5 hour off, still air required ± (1%+0.05Ω ) for D/F tol ± (3%+0.05Ω ) for J tol <100mR for jumper High Temperature Exposure MIL-STD-202G Method 108A IEC 60115-1 4.25.3 1,000 hours at maximum operating temperature depending on specification, unpowered. ± (1%+0.05Ω ) for D/F tol ± (2%+0.05Ω ) for J tol <50mR for jumper Moisture Resistance MIL-STD-202G Method 106F IEC 60115-1 4.24.2 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts ± (0.5%+0.05Ω ) for D/F tol ± (2%+0.05Ω ) for J tol <100mR for jumper Humidity IEC 60115-1 4.37 Steady state for 1000 hours at 40 °C / 95% R.H. RCWV applied for 1.5 hours on and 0.5 hour off ± (1%+0.05Ω ) for D/F tol ± (2%+0.05Ω ) for J tol <100mR for jumper Thermal Shock MIL-STD-202G Method 107G -55/+125℃ Note Number of cycles required is 300 Devices mounted Maximum transfer time is 20 seconds Dwell time is 15 minutes. Air - Air ± (0.5%+0.05Ω ) for D/F tol ± (1%+0.05Ω ) for J tol <50mR for jumper Short Time Overload IEC 60115-1 4.13 2.5 times RCWV or maximum overload voltage which is less for 5 seconds at room temperature ± (1%+0.05Ω ) for D/F tol ± (2%+0.05Ω ) for J tol <50mR for jumper No visible damage Board Flex/ Bending IEC 60115-1 4.33 Device mounted or as described only 1 board bending required bending time: 60± 5 seconds 0100/0201/0402:5mm; 0603/0805:3mm; 1206 and above:2mm ± (1%+0.05Ω ) for D/F/J Tol <50mR for jumper No visible damage Table 8 Test condition, procedure and requirements |
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