2

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Symbol

Definition

Min.

Max.

Units

High side floating absolute voltage

-0.3

625

High side floating supply offset voltage

High side floating output voltage

Low side and logic fixed supply voltage

-0.3

25

Low side output voltage

-0.3

Logic input voltage (HIN & LIN - IR2181/IR21814)

Logic ground (IR21814 only)

Allowable offset supply voltage transient

—

50

V/ns

(8-lead PDIP)

—

1.0

(8-lead SOIC)

—

0.625

(14-lead PDIP)

—

1.6

(14-lead SOIC)

—

1.0

Thermal resistance, junction to ambient

(8-lead PDIP)

—

125

(8-lead SOIC)

—

200

(14-lead PDIP)

—

75

(14-lead SOIC)

—

120

Junction temperature

—

150

Storage temperature

-50

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured

under board mounted and still air conditions.

V

°C/W

W

°C

DT97-3 for more details).

Note 2: HIN and LIN pins are internally clamped with a 5.2V zener diode.

VB

High side floating supply absolute voltage

High side floating supply offset voltage

Note 1

600

High side floating output voltage

Low side and logic fixed supply voltage

10

20

Low side output voltage

0

Logic input voltage (HIN & LIN - IR2181/IR21814)

Logic ground (IR21814/IR21824 only)

-5

5

Ambient temperature

-40

125

°C

V

Symbol

Definition

Min.

Max.

Units

Recommended Operating Conditions

The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the