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TPS65263-1Q1

SLVSDY9 – MARCH 2017

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Pin Functions (continued)

PIN

DESCRIPTION

NAME

NO.

LX3

15

Switching node connection to the inductor and bootstrap capacitor for buck3. The voltage swing at this pin is from a

diode voltage below the ground up to PVIN3 voltage.

BST3

16

Boot-strapped supply to the high-side floating gate driver in buck3. Connect a capacitor (recommend 47 nF) from BST3

pin to LX3 pin.

SS3

17

Soft-start and tracking input for buck3. An internal 5.2-µA pullup current source is connected to this pin. The soft-start

time can be programmed by connecting a capacitor between this pin and ground.

COMP3

18

Error amplifier output and loop compensation pin for buck3. Connect a series resistor and capacitor to compensate the

control loop of buck3 with peak current PWM mode.

FB3

19

Feedback Kelvin sensing pin for buck3 output voltage. Connect this pin to buck3 resistor divider.

PGOOD

20

Output voltage supervision pin. When all bucks are in PGOOD monitor’s regulation range, PGOOD is asserted high.

ROSC

21

Clock frequency adjustment pin. Connect a resistor from this pin to ground to adjust the clock frequency. When

connected to an external clock, the internal oscillator synchronizes to the external clock.

FB1

22

Feedback Kelvin sensing pin for buck1 output voltage. Connect this pin to buck1 resistor divider.

COMP1

23

Error amplifier output and loop compensation pin for buck1. Connect a series resistor and capacitor to compensate the

control loop of buck1 with peak current PWM mode.

SS1

24

Soft-start and tracking input for buck1. An internal 5.2-µA pullup current source is connected to this pin. The soft-start

time can be programmed by connecting a capacitor between this pin and ground.

BST1

25

Boot-strapped supply to the high-side floating gate driver in buck1. Connect a capacitor (recommend 47 nF) from BST1

pin to LX1 pin.

LX1

26

Switching node connection to the inductor and bootstrap capacitor for buck1. The voltage swing at this pin is from a

diode voltage below the ground up to PVIN1 voltage.

PGND1

27

Power ground connection of buck1. Connect PGND1 pin as close as practical to the (–) terminal of VIN1 input ceramic

capacitor.

PVIN1

28

Input power supply for buck1. Connect PVIN1 pin as close as practical to the (+) terminal of an input ceramic capacitor

(suggest 10 µF).

VIN

29

Buck controller power supply

V7V

30

Internal LDO for gate driver and internal controller. Connect a 1-µF capacitor from the pin to power ground.

EN1

31

Enable for buck1. Float to enable. Can use this pin to adjust the input UVLO of buck1 with a resistor divider.

EN2

32

Enable for buck2. Float to enable. Can use this pin to adjust the input UVLO of buck2 with a resistor divider.

PAD

—

There is no electric signal down bonded to thermal pad inside IC. Exposed thermal pad must be soldered to PCB for

optimal thermal performance.