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Model BD1722J50100AHF

Rev A

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/

An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased

footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique

dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.

No Bias Footprint

Circuit Pattern

Footprint Pad (s)

Solder Resist

Mounting Footprint

Dimensions are in Millimeters

6x .41

6x .33

.04

4x .25

.66

3x Transmission

lines

Plated thru holes to ground

Plated thru

holes to

ground

DC Bias Footprint

6x .41

6x .33

.04

4x .25

.66

3x Transmission

lines

Plated thru

holes to

ground

Circuit Pattern

Footprint Pad (s)

Solder Resist

Mounting Footprint

Dimensions are in Millimeters

Capacitor

Plated thru

holes to

ground

DC Bias