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BALF-SPI-02D3 Datasheet(PDF) 10 Page - STMicroelectronics |
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BALF-SPI-02D3 Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 12 page Package information BALF-SPI-02D3 10/12 DocID027278 Rev 4 3.2 Flip-chip 6 bumps packing information Figure 20: Marking Figure 21: Flip Chip tape and reel specifications More packing information is available in the application note: AN2348 Flip- Chip: “Package description and recommendations for use” x y x w z w Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode |
Similar Part No. - BALF-SPI-02D3 |
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Similar Description - BALF-SPI-02D3 |
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