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T498B227K050AHE500 Datasheet(PDF) 10 Page - Kemet Corporation |
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T498B227K050AHE500 Datasheet(HTML) 10 Page - Kemet Corporation |
10 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2053_T498_AUTO • 8/10/2016 10 10 Tantalum Surface Mount Capacitors – Automotive Grade T498 Series Automotive Grade MnO2 150°C Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity.Thepositiveterminalisidentifiedonthecapacitorbodybyastripeplusinsomecasesabevelededge.Asmall degree of transient reverse voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 15% of Rated Voltage 85°C 5% of Rated Voltage 125°C 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard KEMET Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 A 3216–18 1.35 2.20 0.62 6.02 2.80 1.23 1.80 0.82 4.92 2.30 1.13 1.42 0.98 4.06 2.04 B 3528–21 2.35 2.21 0.92 6.32 4.00 2.23 1.80 1.12 5.22 3.50 2.13 1.42 1.28 4.36 3.24 C 6032–25 2.35 2.77 2.37 8.92 4.50 2.23 2.37 2.57 7.82 4.00 2.13 1.99 2.73 6.96 3.74 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 X1 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). 1 Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. L S W W L V1 V2 Grid Placement Courtyard |
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