9

T2525

4657D–AUTO–11/03

Notes:

1. xx means the used carrier frequency value f

2. Two pad layout versions (see Figure 11 and Figure 12) available for different assembly demand

3. Integrated pull-up resistor at pin OUT (see “Electrical Characteristics”)

4. Typical data transmission rate up to bit/s with f

5. yyy means kind of packaging:

.................... .......DDW -> unsawn wafers in box

.................... .......6AQ -> (only on request, TSSOP8 taped and reeled)

Pad Layout

Figure 11. Pad Layout 1 (DDW only)

Figure 12. Pad Layout 2 (DDW, SO8 or TSSOP8)

Ordering Information

Extended Type

Number

PL

(2)

R

PU

(3)

D

(4)

Type

2

30

2090

Standard type:

³ 10 pulses, enhanced sensibility, high data rate

1

30

2090

Standard type:

³ 10 pulses, enhanced sensibility, high data rate

2

40

1373

Lamp type:

³ 10 pulses, enhanced suppression of disturbances, secure

data transmission

1

40

1373

Lamp type:

³ 10 pulses, enhanced suppression of disturbances, secure

data transmission

2

30

3415

Short burst type:

³ 6 pulses, enhanced data rate

1

30

3415

Short burst type:

³ 6 pulses, enhanced data rate

T2525

GND

IN

OUT

FUSING

VS

GND

IN

OUT

VS

T2525

FUSING

(1)

(3)

(6)

(5)