www.pulseelectronics.com

WC706.C (01/16)

Pulse Jack

E l e c t r o n i c s

WC706.C (01/16)

www.pulseelectronics.com

CHIP FERRITE BEADS

Life Test

Appearance: No damage.

Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC

Impedance: within

±15% of initial value

J-STD-020D Classification Reflow Profiles)

Inductance: within

±10% of initial value

Temperature: 125

±2�C(bead),

Q: Shall not exceed the specification value

85

±2�C(inductor)

RDC: within

±15% of initial value and shall not exceed the

Applied current: rated current

specification value

Duration: 1000

±12hrs.

Measured at room temperature after placing for 24

±2 hrs.

Load Humidity

Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC

J-STD-020D Classification Reflow Profiles)

Humidity: 85

±2%R.H.

Temperature: 85

±2�C

Duration: 1000hrs Min. with 100% rated current.

Measured at room temperature after placing for 24

±2 hrs.

Thermal Shock

Appearance: no damage

Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC

Impedance: within

±15% of initial value

J-STD-020D Classification Reflow Profiles)

Inductance: within

±10% of initial value

Condition for 1 cycle

Q: Shall not exceed the specification value

Step1: -40

±2�C 30±5 min.

RDC: Shall not exceed the specification value

Step2: 25

±2�C≤30±0.5 min.

Step3: +105

±2�C 30±5 min.

Number of cycles: 500

Measured at room temperature after placing for 24

±2 hrs.

Insulation

IR>1G

Ω

Chip Inductor Only

Resistance

Test Voltage: 100

±10%V for 30Sec

Wave

For the ferrite chip bead which withstanding current

over 1.5A, as operating temperature over 85�C, the

derating current information is necessary to consider.

For the detail derating of current, please refer to the

Derated Current vs. perating Temperature curve.

6. Soldering

5. **Derating Curve

Mildly activated rosin fluxes are preferred. The termination are suitable for re-flow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Note. If wave soldering is used, there will be some risk. Re-flow soldering temperatures below 240 degrees, there will

be non-wetting risk.

5