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LP2957IT Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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LP2957IT Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 14 page Electrical Characteristics (Continued) Limits in standard typeface are for T J = 25˚C, and limits in boldface type apply over the full operating temperature range. Un- less otherwise specified: V IN = 6V, IL = 1 mA, CL = 2.2 µF, VSD = 3V. Symbol Parameter Conditions Typical LP2957AI LP2957I Units Min Max Min Max e n Output Noise Voltage C L = 2.2 µF 500 µV RMS (10 Hz to 100 kHz) I L = 100 mA C L = 33 µF 320 SHUTDOWN INPUT V SD (ON) Output Turn-On 1.155 1.305 1.155 1.305 V Threshold Voltage 1.140 1.320 1.140 1.320 HYST Hysteresis 6 mV I B Input Bias V IN(SD) = 0V to 5V 10 −30 30 −30 30 nA Current −50 50 −50 50 DROPOUT DETECTION COMPARATOR I OH Output “HIGH” V OH = 30V 0.01 1 1 µA Leakage 22 V OL Output “LOW” V IN = 4V 150 250 250 mV Voltage I O(COMP) = 400 µA 400 400 V THR Upper Threshold (Note 8) −240 −320 −150 −320 −150 mV (Max) Voltage −380 −100 −380 −100 V THR Lower Threshold (Note 8) −350 −450 −230 −450 −230 mV (Min) Voltage −640 −160 −640 −160 HYST Hysteresis (Note 8) 60 mV Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the de- vice outside of its rated operating conditions. Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, T J(MAX), the junction-to-ambient thermal resistance, θ JA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60˚C/W and 73˚C/W for the TO-263. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 Square inches of copper area, θ JA is 50˚C/W, with 1 square inch of copper area, θJA is 37˚C/W; and with 1.6 or more square inches of copper area, θ JA is 32˚C/W. The junction-to-case thermal resistance is 3˚C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the junction-to-case resistance (3˚C/W), the specified thermal resistance of the heatsink se- lected, and the thermal resistance of the interface between the heatsink and the LP2957 (see Application Hints). Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested separately for load regulation in the load ranges 0.1 mA–1 mA and 1 mA–250 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output voltage differential at which the output voltage drops 100 mV below the value measured with a 1V input to output differential. Note 6: Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the load current plus the ground pin current. Note 7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation ef- fects. Specifications are for a 200 mA load pulse at VIN = 20V (3W pulse) for T = 10 ms. Note 8: Voltages are referenced to the nominal regulated output voltage. Note 9: When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped to ground. www.national.com 3 |
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