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SGA-9189 Datasheet(PDF) 5 Page - Stanford Microdevices

Part # SGA-9189
Description  Reliability Qualification Report
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Manufacturer  STANFORD [Stanford Microdevices]
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SGA-9189 Reliability Qualification Report
Operational and Accelerated Life Testing
The purpose of the operational life test is to statistically show that the product operated at
125oC will be reliable. This is accomplished by operating several hundred devices for a
total test time of 1000 hours. The results for this test are expressed in device hours which
are calculated by multiplying the total number of devices passing by the number of hours
tested.
Operational Life Test Results
The results for SGA-9189 High Temperature Operating Life Test are as follows:
Group
Test Time
(hours)
Quantity
In
Quantity
Out
Device
Hours
A2
1000
189
189
189,000
Table 2: High Temperature Operational Life Test Results
Accelerated Life Test Results
The following data demonstrates the results from accelerated life tests performed on the
Stanford 4A SiGe HBT Process. The test was performed on 77 units running at a peak
junction temperature of 195oC. The test exceeded 10,000 hours (1.14 years) with no
failures. The FIT rate / MTTF calculation can be found below. The FIT rates were
generated assuming 1 failure. In reality, there were no failures, making this a very
conservative calculation.
Stanford Microdevices Process 4ASiGe HBT
FIT Rate / MTTF Calculation
SGA Series Devices
**Stanford Microdevices does not assume any liability arising from the use of this data.
*Ea = 0.7 eV
Parameters
Junction Temp C FIT Rate
MTTF (hrs)
55
0.053
1.89E+10
125
4.136
2.42E+08
*The Ea of 0.7eV is conservative, 0.85eV is the activation energy for electomigration which is assumed to be the primary failure mechanism for
the SiGe process.


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