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HLMP-HG70 Datasheet(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED

Part # HLMP-HG70
Description  5mm Standard Oval Red and Amber LEDs
Download  13 Pages
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Manufacturer  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Direct Link  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-HG70 Datasheet(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED

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Avago Technologies
- 8 -
HLMP-HG70/71, HLMP-HL70/71
Data Sheet
Avago Color Bin on CIE 1931 Chromaticity Diagram
Avago Color Bin on CIE 1931 Chromaticity
Diagram
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on the PC board.
For better control, it is recommended to use the proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after the
soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress due to
lead cutting from traveling into LED package. This is highly
recommended for hand solder operation, as the excess
lead length also acts as small heat sink.
Soldering and Handling
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
The LED component may be effectively hand soldered to
PCB. However, it is only recommended under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source (soldering
iron’s tip) to the body is 1.59 mm. Soldering the LED using
soldering iron tip closer than 1.59 mm might damage
the LED.
ESD precaution must be properly applied on the soldering
station and personnel to prevent ESD damage to the LED
component that is ESD sensitive. Refer to Avago
application note AN 1142 for details. The soldering iron
used should have a grounded tip to ensure that
electrostatic charge is properly grounded.
Recommended soldering condition follows.
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. The customer is advised to perform a daily check on
the soldering profile to ensure that it always conforms to
the recommended soldering conditions.
NOTE
1.
PCBs with different size and design (component
density) will have different heat mass (heat
capacity). This might cause a change in
temperature experienced by the board if the
same wave soldering setting is used. So, it is
recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2.
Avago Technologies’ high brightness LEDs use a
high efficiency LED die with single wire bond as
shown on the next page. The customer is advised
to take extra precautions during wave soldering
to ensure that the maximum wave temperature
does not exceed 260 °C and the solder contact
time does not exceed 5 s. Over-stressing the LED
during soldering process might cause premature
failure to the LED due to delamination.
0.280
0.300
0.320
0.340
0.360
0.380
0.400
0.420
0.440
0.460
0.480
0.500
0.550
0.600
0.650
0.700
0.750
0.800
X
1
2
4
6
Amber
Red
Wave Solderinga, b
a.
The above conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
b.
It is recommended to use only bottom preheaters to reduce thermal
stress experienced by the LED.
Manual Solder
Dipping
Pre-heat temperature 105 °C Max.
Preheat time
60 s Max
Peak temperature
260 °C Max.
260 °C Max.
Dwell time
5 s Max.
5 s Max
1.59 mm


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