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HLMP-HG70 Datasheet(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HG70 Datasheet(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 13 page Avago Technologies - 8 - HLMP-HG70/71, HLMP-HL70/71 Data Sheet Avago Color Bin on CIE 1931 Chromaticity Diagram Avago Color Bin on CIE 1931 Chromaticity Diagram Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on the PC board. For better control, it is recommended to use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Avago application note AN 1142 for details. The soldering iron used should have a grounded tip to ensure that electrostatic charge is properly grounded. Recommended soldering condition follows. Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform a daily check on the soldering profile to ensure that it always conforms to the recommended soldering conditions. NOTE 1. PCBs with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single wire bond as shown on the next page. The customer is advised to take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 260 °C and the solder contact time does not exceed 5 s. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. 0.280 0.300 0.320 0.340 0.360 0.380 0.400 0.420 0.440 0.460 0.480 0.500 0.550 0.600 0.650 0.700 0.750 0.800 X 1 2 4 6 Amber Red Wave Solderinga, b a. The above conditions refer to measurement with a thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters to reduce thermal stress experienced by the LED. Manual Solder Dipping Pre-heat temperature 105 °C Max. — Preheat time 60 s Max — Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 s Max. 5 s Max 1.59 mm |
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