ACPL-K49U datasheet(9/9 Pages) AVAGO

Part #	ACPL-K49U

Description	High Temperature and Reliability low speed digital interface for Industrial Application.

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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AV02-3826EN - October 2, 2012

Figure 12. Test Circuit for Transient Immunity and Typical Waveforms (4-Pin Configuration)

8

7

6

5

1

2

3

4

IF

VCC

RL

VO

CL = 15 pF

VFF

+

–

VCM Pulse Gen.

5 V

VCM

VO

tr

tf

VOL

10%

90%

10%

90%

Tr = tf = 80 ns

Switch at IF = 0 mA

VO

Switch at IF = 4 mA

1500 V

Thermal Resistance Model for ACPL-K49U

The diagram of ACPL-K49U for measurement is shown in

Figure 13. Here, one die is heated first and the tempera-

tures of all the dice are recorded after thermal equilib-

rium is reached. Then, the 2nd die is heated and all the

dice temperatures are recorded. With the known ambient

temperature, the die junction temperature and power

dissipation, the thermal resistance can be calculated. The

thermal resistance calculation can be cast in matrix form.

This yields a 2 by 2 matrix for our case of two heat sources.

R11

R12

X

P1

=

T1

R21

R22

P2

T2

1

2

3

4

8

7

6

5

Die 1:

LED

Die 2:

Detector

Figure 13, Diagram of ACPL-K49U for measurement

R11: Thermal Resistance of Die1 due to heating of Die1

R12: Thermal Resistance of Die1 due to heating of Die2.

R21: Thermal Resistance of Die2 due to heating of Die1.

R22: Thermal Resistance of Die2 due to heating of Die2.

P1: Power dissipation of Die1 (W).

P2: Power dissipation of Die2 (W).

T1: Junction temperature of Die1 due to heat from all dice (°C).

T2: Junction temperature of Die2 due to heat from all dice.

Ta: Ambient temperature.

T1: Temperature difference between Die1 junction and ambient (°C).

T2: Temperature deference between Die2 junction and ambient (°C).

T1 = (R11 x P1 + R12 x P2) + Ta

T2 = (R21 x P1 + R22 x P2) + Ta

Measurement data on a low K board:

R11 = 160°C/W, R12 = R21 = 74°C/W, R22 = 115°C/W

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