5

Regulatory Information

Both ACPL-072L and ACPL-772L are approved by the following organizations:

Solder Reflow Temperature Profile

Note: Non-halide flux should be used

Recommended Pb-Free IR Profile

Note: Non-halide flux should be used

RAMP-DOWN

RAMP-UP

60 to 150 SEC.

20-40 SEC.

PEAKTEMPERATURE

PREHEAT

60 to 180 SEC.

25

TIME

NO TES:

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160 ˚C

140 ˚C

150 ˚C

PEAK

TEMP.

245 ˚C

PEAK

TEMP.

240 ˚C

PEAK

TEMP.

230˚C

SOLDERING

TIME

200˚C

PREHEATING TIME

150 ˚C, 90 + 30 SEC.

2.5˚ C ± 0.5˚C/SEC.

3˚C + 1 ˚C/- 0.5 ˚C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3˚C + 1 ˚C/- 0.5 ˚C/SEC.

REFLOW HEATING RATE 2.5˚C ± 0.5 ˚C/SEC.

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.

(option 060 only)

UL

Approved under UL 1577, component recognition

program up, File E55361.

CSA

Approved under CSA Component Acceptance Notice #5,

File CA 88324.