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LMX2332LTM Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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LMX2332LTM Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 21 page Connection Diagrams Pin Descriptions Pin No. LMX233XLSLB 24-pinCSP Package Pin No. LMX233XLTM 20-pin TSSOP Package Pin Name I/O Description 24 1 V CC1 — Power supply voltage input for RF analog and RF digital circuits. Input may range from 2.7V to 5.5V. V CC1 must equal VCC2. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane. 22 V P1 — Power Supply for RF charge pump. Must be ≥ V CC. 33 D o RF O Internal charge pump output. For connection to a loop filter for driving the input of an external VCO. 4 4 GND — Ground for RF digital circuitry. 55 f IN RF I RF prescaler input. Small signal input from the VCO. 66 f IN RF I RF prescaler complementary input. A bypass capacitor should be placed as close as possible to this pin and be connected directly to the ground plane. Capacitor is optional with some loss of sensitivity. 7 7 GND — Ground for RF analog circuitry. 8 8 OSC in I Oscillator input. The input has a V CC/2 input threshold and can be driven from an external CMOS or TTL logic gate. 10 9 GND — Ground for IF digital, MICROWIRE™,F oLD, and oscillator circuits. 11 10 F oLD O Multiplexed output of the RF/IF programmable or reference dividers, RF/IF lock detect signals and Fastlock mode. CMOS output (see Programmable Modes). 12 11 Clock I High impedance CMOS Clock input. Data for the various counters is clocked in on the rising edge, into the 22-bit shift register. 14 12 Data I Binary serial data input. Data entered MSB first. The last two bits are the control bits. High impedance CMOS input. Chip Scale Package (SLB) (Top View) DS012806-39 Order Number LMX2330LSLB, LMX2331LSLB or LMX2332LSLB NS Package Number SLB24A Thin Shrink Small Outline Package (TM) (Top View) DS012806-2 Order Number LMX2330LTM, LMX2331LTM or LMX2332LTM NS Package Number MTC20 www.national.com 2 |
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