+3.3V, 2.5Gbps Low-Power

Limiting Amplifiers

10

______________________________________________________________________________________

+3.3V

+3.3V

+3.3V

CAZ1

OUTPOL

CAZ2

0.1

µF

0.1

µF

TH

SQUELCH

*THE MAX3202E PROVIDES ESD PROTECTION ON THE LOS PIN

CLOS

100

Ω

IN-

IN+

OUT+

SDI+

SDO+

SDO-

SCLKO-

SCLKO+

SDI-

GND

CDR

OUT-

MAX3271

MAX3272

MAX3873

LOS

GND

LOSS

OF

SIGNAL

LOS

LEVEL

+3.3V

I/01

GND

MAX3202E*

Typical Operating Circuit (continued)

Wire Bonding Die

For high-current density and reliable operation, the

MAX3272 uses gold metallization. Make connections to

the dice with gold wire only, and use ball-bonding tech-

niques (wedge bonding is not recommended). Die pad

dimensions are 94.4 microns by 94.4 microns. Die

thickness is 15 mils (0.375mm).