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PU5931JKHT50R001L Datasheet(PDF) 8 Page - YAGEO Corporation

Part # PU5931JKHT50R001L
Description  SHUNT RESISTOR
Download  9 Pages
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

PU5931JKHT50R001L Datasheet(HTML) 8 Page - YAGEO Corporation

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background image
-
Chip Resistor Surface Mount
Product specification
8
9
SERIES
PU
3921/ 5931
www.yageo.com
Jan. 16, 2017 V.2
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Short Time
Overload
IEC60115-1 4.13
5 times of rated power for 5 seconds at room
temperature
± (1%+0.0005 Ω)
No visible damage
High
Temperature
Exposure
AEC-Q200 Test 3
MIL-STD-202 method 108A
IEC 60115-1 4.25.3
1,000 hours at maximum operating temperature
depending on specification, unpowered,
Normal Temperature Range Type:170± 3°C
High Temperature Range Type: 275± 5°C
± (1%+0.0005 Ω)
Moisture
Resistance
AEC-Q200 Test 6
MIL-STD-202 method 106F
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24± 2 hours after test conclusion
± (1%+0.0005 Ω)
Biased Humidity
AEC-Q200 Test 7
MIL-STD-202 method 103
1,000 hours; 85 °C / 85% RH
10% of operating power
Measurement at 24± 4 hours after test conclusion.
± (1%+0.0005 Ω)
Life/ Operational
Life/ Endurance
AEC-Q200 Test 8
MIL-STD-202 method 108A
IEC 60115-1 4.25.1
1,000 hours at 70± 5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (1%+0.0005 Ω)
- Resistance to
Soldering Heat
AEC-Q200 Test 15
MIL-STD-202 method 210F
IEC 60115-1 4.18
Condition B, no pre-heat of samples
Lead free solder, 260 °C, 10 seconds immersion
time
Procedure 2 for SMD: devices fluxed and cleaned
with isopropanol
± (0.5%+0.0005 Ω)
No visible damage
Thermal Shock
AEC-Q200 Test 16
MIL-STD-202 method 107
-55/+150 °C
Number of cycles is 300.
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air – Air
± (1%+0.0005 Ω)
No visible damage
Board
Flex
/
Bending
AEC-Q200 Test 21
AEC-Q200-005
Chips mounted on a 90mm glass epoxy resin PCB
(FR4)
Bending: 2 mm
Holding time: minimum 60 seconds
± (1%+0.0005 Ω)
Table 6 Test condition, procedure and requirements


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