1.1.3 Bending the lead

(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a

crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6).

(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).

0.5mm

D

0.5mm

Solder

Printed circuit

board

Solder

Solder

L > D

L

Figure 7

Figure 6

Figure 5

Make the length from the

case to the printed circuit

board (L) longer than the

case diameter (D) so that

the lead wire will not be

pulled in case the crystal

unit falls over.

Soldering directly to the case will reduce the degree of vacuum and may result in

deterioration of the characteristics and may break the crystal chip.

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1.1.4 Soldering

When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a

lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may

break the crystal unit. Be sure to keep the case at or below 150°C.