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NC26LF Datasheet(PDF) 3 Page - Fox Electronics |
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NC26LF Datasheet(HTML) 3 Page - Fox Electronics |
3 / 3 page 1.1.3 Bending the lead (1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6). (2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7). 0.5mm D 0.5mm Solder Printed circuit board Solder Solder L > D L Figure 7 Figure 6 Figure 5 Make the length from the case to the printed circuit board (L) longer than the case diameter (D) so that the lead wire will not be pulled in case the crystal unit falls over. Soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip. Page 2 of 2 7/7/2011 1.1.4 Soldering When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may break the crystal unit. Be sure to keep the case at or below 150°C. |
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