SQ2315ES

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Vishay Siliconix

S15-2411-Rev. D, 07-Oct-15

5

Document Number: 71507

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Normalized Thermal Transient Impedance, Junction-to-Foot

Normalized Thermal Transient Impedance, Junction-to-Ambient

Note

• The characteristics shown in the two graphs

- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)

- Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)

are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single

pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part

mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities

can widely vary depending on actual application parameters and operating conditions.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

0

1

1

0.2

0.1

Duty Cycle = 0.5

Square Wave Pulse Duration (s)

1

0.1

0.01

Single Pulse

0.02

0.05

Notes:

1. Duty Cycle, D =

4. Surface Mounted

1

10

1000

100

0.2

0.1

Square Wave Pulse Duration (s)

1

0.1

0.01

Duty Cycle = 0.5

Single Pulse

0.02

0.05