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NRVBM120ET1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NRVBM120ET1G
Description  Surface Mount Schottky Power Rectifier
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NRVBM120ET1G Datasheet(HTML) 1 Page - ON Semiconductor

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 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 3
1
Publication Order Number:
MBRM120E/D
MBRM120ET1G,
NRVBM120ET1G,
MBRM120ET3G,
NRVBM120ET3G
Surface Mount
Schottky Power Rectifier
POWERMITE
Power Surface Mount Package
The Schottky POWERMITEemploys the Schottky Barrier
principle with a barrier metal and epitaxial construction that produces
optimal forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the POWERMITEhas the same thermal performance as the SMA
while being 50% smaller in footprint area, and delivering one of the
lowest height profiles,  1.1 mm in the industry. Because of its small
size, it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
Features
Low Profile − Maximum Height of 1.1 mm
Small Footprint − Footprint Area of 8.45 mm2
Low VF Provides Higher Efficiency and Extends Battery Life
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 16,000 V)
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
AEC−Q101 Qualified and PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
POWERMITEis JEDEC Registered as DO−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes
260C Maximum for 10 Seconds
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES, 20 VOLTS
POWERMITE
CASE 457
STYLE 1
BCV
= Device Code
M
= Date Code
G
= Pb−Free Package
MARKING DIAGRAM
M
BCVG
12
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
Package
Shipping
ORDERING INFORMATION
MBRM120ET1G
POWERMITE
(Pb−Free)
3,000 /
Tape & Reel
MBRM120ET3G
POWERMITE
(Pb−Free)
12,000 /
Tape & Reel
NRVBM120ET1G
POWERMITE
(Pb−Free)
3,000 /
Tape & Reel
NRVBM120ET3G
POWERMITE
(Pb−Free)
12,000 /
Tape & Reel


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