H04-004-03

Fuji Electric Co.,Ltd.

8.Reliability test items

All guaranteed values are under the categories of reliability per non-assembled(only MOSFETs).

Each categories under the guaranteed reliability conform to EIAJ ED4701 B101A standards.

Test items required without fail : Test Method B-121,B-122,B-123,B-131,B-141

Humidification treatment (85±2°C,65±5%RH,168±24hr)

Heat treatment of soldering (Solder Dipping,260±5°C(265°Cmax.),10±1sec,2 times)

Test

Test

Testing methods and Conditions

Reference

Sampling

Acceptance

No.

Items

Standard

number

number

EIAJ ED4701

1 Terminal

Pull force

Strength

TO-220,TO-220F : 10N

(Tensile)

TO-3P,TO-3PF,TO-247 : 25N

A-111A

15

TO-3PL : 45N

method 1

T-Pack,K-Pack : 10N

Force maintaining duration :30±5sec

2 Terminal

Load force

Strength

TO-220,TO-220F : 5N

(Bending)

TO-3P,TO-3PF,TO-247 : 10N

A-111A

15

TO-3PL : 15N

method 3

T-Pack,K-Pack : 5N

Number of times :2times(90deg./time)

3 Mounting

Screwing torque value: (M3)

(0:1)

Strength

TO-220,TO-220F : 40±10N

A-112

15

TO-3P,TO-3PF,TO-247 : 50±10N

method 2

TO-3PL : 70±10N

4 Vibration

frequency : 100Hz to 2kHz

Acceleration : 100m/s

2

A-121

15

Sweeping time : 20min./1 cycle

test code C

6times for each X,Y&Z directions.

5 Shock

Peak amplitude: 15km/s

2

A-122

Duration time : 0.5ms

test code D

15

3times for each X,Y&Z directions.

6 Solderability

Solder temp. : 235

±5°C

Immersion time : 5

±0.5sec

A-131A

Each terminal shall be immersed in

test code A

15

the solder bath within 1 to 1.5mm from

the body.

7 Resistance to

Solder temp. : 260

±5°C

Soldering Heat

Immersion time : 10

±1sec

A-132

15

Number of times : 2times