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TMP95CW65F Datasheet(PDF) 8 Page - Toshiba Semiconductor |
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TMP95CW65F Datasheet(HTML) 8 Page - Toshiba Semiconductor |
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8 / 48 page  Quality and Reliability Assurance / Handling Precautions 030901 QUA-8 2002-02-20 2.1.1 Precaution for Dry Pack Figure 2.2 shows the tray type of the dry pack form. Precaution for handling dry pack products are as follows. x Do not toss or drop to avoid damaging the devices and/or the moisture proof bag. y Desiccant in the form of granulated silica gel includes blue indicator beads which become transparent when moisture is present, such as if the bag is torn or opened. In this case, the devices must be high temperature baked to remove the moisture prior to solder mounting. z Store the pack at 30°C / 90%RH. After opening the pack mount it the device within 12 months of the date on the seal. If the 30% humidity indicator is entirely pink when the device unpacked, or when the 12- month duration has expired treat the device before use at high temperature (bake it at more than 125 °C for 20h) to remove moisture. { How quickly a product should be used after the pack is opened depends of the product. See Tables 2-2 and 2-3 for details. If the time limit for use has expired when devices are unpacked, they should be baked. | Devices in heat-proof trays should be baked at 125 °C for at least 20h. Heat-proof trays bear the mold marking “HEAT PROOF” . Be careful not to bend the leads when baking devices. } Binding trays using a plastic tapes If trays are rebound with plastic tapes after having been untied, two tapes should be used as shown in Figure 2.2 (a). If a tape is tied lengthwise along the trays the tray edges may break. Figure 2.2 SMDs Dry pack Form (a) Method Heat-proof tray (occasionally non-heat-proof) Moisture proof bag (Aluminum laminate) Heat proof tray Corrugated cardboard box Heat seal Turn under Label Plastic band Indicator Silica gel IC (b) Shipping carton Sealing tape Corrugated cardboard box |
Similar Part No. - TMP95CW65F |
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Similar Description - TMP95CW65F |
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