 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TMP95C061BF Datasheet(PDF) 6 Page - Toshiba Semiconductor |
|
||||||||||||||||||||||||||||||
TMP95C061BF Datasheet(HTML) 6 Page - Toshiba Semiconductor |
|
|
6 / 48 page  Quality and Reliability Assurance / Handling Precautions 030901 QUA-6 2002-02-20 Table 2.1 Recommended soldering methods and precautions when mounting Soldering method Mounting method Mounting precaution Localized heating method Soldering iron method The recommended soldering conditions are as follows: (1) Standard: EIAJ ED-4701A-133 Environment test, soldering heat- resistance test (SMD) (2) Soldering method: Soldering (lead only) (3) Soldering condition: (a) at 350 °C for up to 3 seconds. (b) at 260 °C for up to 10 seconds. Wave soldering method (Solder flow) (1) Apply preheating for 60 to 120 seconds at a temperature of 150°C. (2) For lead insertion-type packages, complete solder flow within 10 seconds with the temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from the body) which does not exceed 260°C. (3) For surface-mount packages, complete soldering within 5 seconds at a temperature of 250°C or less in order to prevent thermal stress in the device. For details, contact your local Toshiba dealer. Short infrared reflow method Because thermal stress is severe, as with solder dipping, the infrared reflow method is not recommended for some products. For details, contact your local Toshiba dealer. Overall heating method Far or middle infrared Hot air reflow The recommended conditions for SMD reflow are as follows: (1) Standard: EIAJ ED-4701 A-133 Environment test (2) Soldering method: (a) Hot air reflow (with optional far or middle infrared reflow process) (b) Far or middle infrared reflow (3) Pre-heating: 140 to 160 °C, for 60 to 120 seconds. (4) Reflow: (a) 240 °C max (b) At more than 210 °C, for 30 to 50 seconds. (5) Number of reflows: Maximum of two times within the allowable period of use The specified soldering temperatures are based on the temperature of the package surface. For a sample recommended temperature profile, refer to Figure 2.1. |
Similar Part No. - TMP95C061BF |
|
Similar Description - TMP95C061BF |
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
