SPSEMI

Rating And Characteristic Curves

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Fig.3 Pulse Waverform

0

0

1.0

2.0

4.0

3.0

10/1000 s Waveform

μ

as defined by R.E.A

Half Value

2

tr=10 s

μ

Peak Value

T=25

J

℃

Pulse width(td) is defined

ad the Point where the Peak

50

100

150

t-Time(mS)

td

1

10

100

100

350

450

5

50

..

.

Fig.4 Typical Junction Capacitance

0.0

50.0

1

100

1000

V

-Reverse Breakdown Voltage(V)

BR

10000

Fig.5 Steady State Power Dissipation Derating Curve

0

0

50

75

150

100

1.0

2.0

T - Lead Temperature (°C)

L

25

125

175 200

3.0

8.0

L = 0.375" (9.5 mm)

Lead Lengths

1.6×1.6×0.040"

(40×40×1mm)

Copper Heat Sirks

4.0

5.0

6.0

7.0

Resistive or

Inductive Load

150

250

Fig.6 Maximum Non-Repetitive Peak

Forward Surge Current

400

300

200

50

0

TJ=25

℃

Vsig=50mVp-p

Uni-Directional V=0V

Bi-Directional V=0V

100000

10

100.0 150.0 200.0 250.0 300.0 350.0

Recommended Soldering Conditions

Recommended Conditions

Reflow Soldering

Time

25

time to peak temperature

(t 25

to peak)

℃

T (min)

s

T (max)

s

Preheat

Ramp-down

Ramp-up

Critical Zone

Tto T

LP

Re”ow Condition

Pb-Free assembly

(see Fig.1)

Pre Heat

-Temperature Min(T

)

s(min)

-Temperature Max(T

)

s(max)

-Time(Min to Max)(t )

s

Average ramp up rate

(Liquidus Temp(T ) to peak)

L

T

to T -Ramp-up Rate

s(max)

L

Re”ow

-Temperature(T )(Liquidus)

L

-Temperature(t )

L

Peak Temp(T )

P

Time within 5

of actual Peak Temp(t )

℃

P

Ramp-down Rate

Time 25

to Peak Temp(T )

℃

P

Do not exceed

+150

℃

+200

℃

60-180secs

3

/sec.Max.

℃

3

/sec.Max.

℃

+217

℃

60-150secs

+260(+0/-5)

℃

30 secs.Max.

6

/sec.Max.

℃

8 min.Max.

+260

℃

30KPA(30KW) Series

REV 2016 08 10