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MR16R0828BN1-CG6 Datasheet(PDF) 3 Page - Samsung semiconductor |
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MR16R0828BN1-CG6 Datasheet(HTML) 3 Page - Samsung semiconductor |
3 / 4 page SERIAL PRESENCE DETECT MR16R0824(6/8/C/G)BN1 - 3 - RAMBUS MODULE Version 1.1 Oct. 2000 39 Max. time between Current Control(=tCCTRL,Max) 8 ms 100ms 64h 40 Max. time between Temp. Calibration(=tTEMP,Max) 8 ms 100ms 64h 41 Min. time between Temp. Calibration Enable and Command(=tTCEN,Min) 8 tCYCLE 150tCYCLE 96h 42 Maximum RAS to Precharge time(=tRAS-R,Max) 8 us 64us 40h 43 Maximum time that a Device can stay in Nap Mode(=tNLIMIT,Max) 8 us 10us 0Ah 44 ACTREFPT[3:0], PCHREFPT[3:0] 4,4 tCYCLE 6tCYCLE, 6tCYCLE 66h 45 CPCHREFPT_DC[3:0], RDREFPT_DC[3:0] 4,4 tCYCLE 5tCYCLE, 5tCYCLE 55h 46 RETREFPT_DC[3:0], WRREFPT_DC[3:0] 4,4 tCYCLE 5tCYCLE, 13tCYCLE 5Dh 47~49 Reserved - - - 00h 50 fRAS[11:8] 4 MHz 400MHz 357MHz 300MHz 01h 01h 01h 51 fRAS[7:0] 8 MHz 90h 65h 2Ch 52 PMAX,HI, PMAX,LO, Tj 1,1,6 °C 0,0,100 °C 0,0,100°C 0,0,100°C 24h 24h 24h 53 HeatSpreader, thermal sensor, Tplate 1,1,6 °C 1,0, 92 °C 1,0,92°C 1,0,92 °C 9Ch 9Ch 9Ch 54 PSTBY,HI 8 1mA 105mA 100mA 90mA 69h 64h 5Ah 55 PACTI,HI 8 2mA 165mA 155mA 140mA 52h 4Dh 46h 56 PACTRW,HI 8 8mA 575mA 525mA 455mA 47h 41h 38h 57 PSTBY,LO 8 1mA 80mA 80mA 80mA 50h 50h 50h 58 PACTI,LO 8 2mA 135mA 135mA 135mA 43h 43h 43h 59 PACTRW,LO 8 8mA 410mA 410mA 410mA 33h 33h 33h 60 PNAP 8 128uA 4.0mA 4.0mA 4.0mA 1Fh 1Fh 1Fh 61 PRESA (Reserved for a future thermal parameter) - - - 00h 62 PRESB (Reserved for a future thermal parameter) - - - 00h 63 Checksum for bytes 0 ~ 62 8 n/a - 86h 20h 99h 3 64 Module Manufacturer ID Code 8 n/a Samsung CEh 3 65~71 ...... Module Manufacturer ID Code 56 n/a Samsung 00h 3 72 Module Manufacturer Location 8 n/a Onyang Korea 01h 3 73 Module Part Number(Memory module) 8 n/a M 4Dh 3 74 Module Part Number(Module Configuration) 8 n/a R 52h 3 75 Module Part Number(Data Bits) 8 n/a 1 31h 3 76 ...... Module Part Number(Data Bits) 8 n/a 6 36h 3 77 Module Part Number(Feature) 8 n/a R 52h 3 78 Module Part Number(Module Density) 8 n/a Blank 20h 3 79 Module Part Number(Module Density) 8 n/a 0 30h 3 80 ...... Module Part Number(Module Density) 8 n/a 8 38h 3 81 Module Part Number (Refresh, # of banks in comp. & interface) 8 n/a 2 32h 3 82 Module Part Number(# of component ) 4d 8 n/a 4 34h 3 6d 8 n/a 6 36h 3 8d 8 n/a 8 38h 3 12d 8 n/a C 43h 3 16d 8 n/a G 47h 3 83 Module Part Number(Component Revision) 8 n/a B 42h 3 84 Module Part Number(Package Type) 8 n/a N 4Eh 3 85 Module Part Number(PCB Revision) 8 n/a 1 31h 3 86 Module Part Number(Hyphen) 8 n/a - (Hyphen) 2Dh 3 87 Module Part Number(Power) 8 n/a C C C 43h 43h 43h 3 88 Module Part Number(tRAC & Speed) 8 n/a K K G 4Bh 4Bh 47h 3 89 Module Part Number(tRAC & Speed) 8 n/a 8 7 6 38h 37h 36h 3 90 Module Part Number(RFU) 8 n/a - 00h 3 Byte # (Dec) Described Function Option Field Width Units Supported Function Hex Value Note K8 K7 G6 K8 K7 G6 |
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