MR16R0828BN1-CG6 datasheet(3/4 Pages) SAMSUNG

Part #	MR16R0828BN1-CG6

Description	RAMBUS MODULE

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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SERIAL PRESENCE DETECT

MR16R0824(6/8/C/G)BN1

- 3 -

RAMBUS MODULE

Version 1.1 Oct. 2000

39

Max. time between Current Control(=tCCTRL,Max)

8

ms

100ms

64h

40

Max. time between Temp. Calibration(=tTEMP,Max)

8

ms

100ms

64h

41

Min. time between Temp. Calibration Enable

and Command(=tTCEN,Min)

8

tCYCLE

150tCYCLE

96h

42

Maximum RAS to Precharge time(=tRAS-R,Max)

8

us

64us

40h

43

Maximum time that a Device can stay in Nap

Mode(=tNLIMIT,Max)

8

us

10us

0Ah

44

ACTREFPT[3:0], PCHREFPT[3:0]

4,4

tCYCLE

6tCYCLE, 6tCYCLE

66h

45

CPCHREFPT_DC[3:0], RDREFPT_DC[3:0]

4,4

tCYCLE

5tCYCLE, 5tCYCLE

55h

46

RETREFPT_DC[3:0], WRREFPT_DC[3:0]

4,4

tCYCLE

5tCYCLE, 13tCYCLE

5Dh

47~49

Reserved

-

00h

50

fRAS[11:8]

4

MHz

400MHz

357MHz

300MHz

01h

51

fRAS[7:0]

8

MHz

90h

65h

2Ch

52

PMAX,HI, PMAX,LO, Tj

1,1,6

°C

0,0,100

°C 0,0,100°C 0,0,100°C

24h

53

HeatSpreader, thermal sensor, Tplate

1,1,6

°C

1,0, 92

°C 1,0,92°C

1,0,92

°C

9Ch

54

PSTBY,HI

8

1mA

105mA

100mA

90mA

69h

64h

5Ah

55

PACTI,HI

8

2mA

165mA

155mA

140mA

52h

4Dh

46h

56

PACTRW,HI

8

8mA

575mA

525mA

455mA

47h

41h

38h

57

PSTBY,LO

8

1mA

80mA

50h

58

PACTI,LO

8

2mA

135mA

43h

59

PACTRW,LO

8

8mA

410mA

33h

60

PNAP

8

128uA

4.0mA

1Fh

61

PRESA (Reserved for a future thermal parameter)

-

00h

62

PRESB (Reserved for a future thermal parameter)

-

00h

63

Checksum for bytes 0 ~ 62

8

n/a

-

86h

20h

99h

3

64

Module Manufacturer ID Code

8

n/a

Samsung

CEh

3

65~71

...... Module Manufacturer ID Code

56

n/a

Samsung

00h

3

72

Module Manufacturer Location

8

n/a

Onyang Korea

01h

3

73

Module Part Number(Memory module)

8

n/a

M

4Dh

3

74

Module Part Number(Module Configuration)

8

n/a

R

52h

3

75

Module Part Number(Data Bits)

8

n/a

1

31h

3

76

...... Module Part Number(Data Bits)

8

n/a

6

36h

3

77

Module Part Number(Feature)

8

n/a

R

52h

3

78

Module Part Number(Module Density)

8

n/a

Blank

20h

3

79

Module Part Number(Module Density)

8

n/a

0

30h

3

80

...... Module Part Number(Module Density)

8

n/a

8

38h

3

81

Module Part Number

(Refresh, # of banks in comp. & interface)

8

n/a

2

32h

3

82

Module Part Number(# of component )

4d

8

n/a

4

34h

3

6d

8

n/a

6

36h

3

8d

8

n/a

8

38h

3

12d

8

n/a

C

43h

3

16d

8

n/a

G

47h

3

83

Module Part Number(Component Revision)

8

n/a

B

42h

3

84

Module Part Number(Package Type)

8

n/a

N

4Eh

3

85

Module Part Number(PCB Revision)

8

n/a

1

31h

3

86

Module Part Number(Hyphen)

8

n/a

- (Hyphen)

2Dh

3

87

Module Part Number(Power)

8

n/a

C

43h

3

88

Module Part Number(tRAC & Speed)

8

n/a

K

G

4Bh

47h

3

89

Module Part Number(tRAC & Speed)

8

n/a

8

7

6

38h

37h

36h

3

90

Module Part Number(RFU)

8

n/a

-

00h

3

Byte #

(Dec)

Described Function

Option

Field

Width

Units

Supported Function

Hex Value

Note

K8

K7

G6

K8

K7

G6

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