VDMR10.0, VDMO10.0, VDMY10.0, VDMG10.0

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 29-Nov-13

7

Document Number: 84196

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

BAR CODE PRODUCT LABEL (example only)

A) 2D barcode

B) Vishay part number

C) Quantity

D) PTC = selection code (binning)

E) Code of manufacturing plant

F) Batch = date code: year/week/plant code

G) Region code

H) SL = sales location

I)

Terminations finishing

K) Lead (Pb)-free symbol

L) Halogen-free symbol

M) RoHS symbol

SOLDERING PROFILE

Fig. 6 - Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020C)

RECOMMENDED SOLDER PAD

MSL LABEL

SOLDERING IRON (one time only)

Temperature

300 °C max.

Soldering time

3 s max.

A

B

D

C

E

F

G

H

I

M

L

K

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

255

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. Ramp Up 3 °C/s

max. Ramp Down 6 °C/s

255 °C

19470-5

IR Reflow Soldering Profile for lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 3

max. 2 cycles allowed

1.65

4 x 1.9 = 7.6