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AF1210FK-079M76 Datasheet(PDF) 7 Page - YAGEO Corporation |
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AF1210FK-079M76 Datasheet(HTML) 7 Page - YAGEO Corporation |
7 / 9 page Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification 7 9 SERIES AF 0201 to 2512 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 MIL-STD-202 Method 304 At +25/–55 °C and +25/+125 °C Refer to table 2 Formula: T.C.R= ------------------------- × 106 (ppm/°C) Where t1=+25 °C or specified room temperature t2=–55 °C or +125 °C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/Endurance IEC 60115-1 4.25 MIL-STD-202 Method 108 At 70± 2 °C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still-air required ± (1.0%+0.05 Ω) <100 mΩ for Jumper High Temperature Exposure MIL-STD-202 Method 108 1,000 hours at 155±3℃ unpowered ± (1.0%+0.05 Ω) <100 mΩ for Jumper Moisture Resistance MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts ± (0.5%+0.05 Ω) for 0.5%, 1% tol. ± (1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Thermal Shock MIL-STD-202 Method 107 –55 / +125 °C Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes ± (0.5%+0.05 Ω) for 0.5%, 1% tol. ± (1%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Short Time Overload IEC60115-1 4.13 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature ± (1.0%+0.05 Ω) No visible damage Bending IEC 60115-1 4.33 Chips mounted on a 90 mm glass epoxy resin PCB (FR4) Bending: 0201/0402: 5 mm 0603/0805: 3 mm 1206 & above: 2 mm Bending time: 60± 5 seconds ± (1.0%+0.05 Ω) <100 mΩ for Jumper No visible damage Table 4 Test condition, procedure and requirements R2–R1 R1(t2–t1) |
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