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AF1210DR-131R5 Datasheet(PDF) 8 Page - YAGEO Corporation |
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AF1210DR-131R5 Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 9 page Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification 8 9 SERIES AF 0201 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity MIL-STD-202 method 103 1,000 hours; 85℃/85%R.H., 10% of operating power. Measurement at 24± 4 hours after test conclusion. 1Ω≤R≤1MΩ: ±(3%+0.05Ω) 1MΩ<R≤10MΩ: ±(5%+0.05Ω) Solderability - Resistance to Soldering Heat IEC 60115-1 4.18 MIL-STD-202 Method 215 Condition B, no pre-heat of samples Lead-free solder, 260± 5 °C, 10± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (0.5%+0.05Ω) for 0.5%, 1% tol. ± (1.0%+0.05Ω) for 5% tol. <50 mΩfor Jumper No visible damage - Wetting J-STD-002 Electrical test not required Magnification 10X SMD conditions: (a) Method B, aging 4 hours at 155 °C dry heat, lead-free solder bath at 245 °C (b) Method B, dipping at 215 °C for 3 seconds Well tinned (≥95% covered) No visible damage FOS ASTM-B-809-95* * Modified Sulfur 750 hours, 105 °C. unpowered ± (4.0%+0.05Ω) |
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