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TSOP753W Datasheet(PDF) 6 Page - Vishay Siliconix

Part # TSOP753W
Description  IR Receiver Modules for Remote Control Systems
Download  12 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TSOP753W Datasheet(HTML) 6 Page - Vishay Siliconix

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TSOP753..W, TSOP755..W
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 22-Jul-16
6
Document Number: 82497
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
22609
Drawing-No.: 6.550-5300.01-4
Issue: 4; 13.09.11
6.6 ± 0.1
1.27
3 x 1.27 = 3.81
(4 x)
(1)
(2.2)
6.8
2.35
0.5 ± 0.1
Pick and place area
0.8
1.27
3 x 1.27 = 3.81
Marking area
(0.635)
(3.25)
Center of
sensitive area
Mold residue
(3 x)
Proposed pad layout
from component side
(for reference only)
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.15
Tool separation line
Mold residue


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