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Vishay Siliconix

Revision: 16-Dec-13

1

Document Number: 62592

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

WCSP12: 12 Bumps

(3 x 4, 0.4 mm pitch, 208 μm bump height, 1.71 mm x 1.31 mm die size)

Notes (unless otherwise specified)

MILLIMETERS (5)

INCHES

DIMENSION

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

0.515

0.530

0.545

0.0203

0.0209

0.0215

A1

0.183

0.208

0.233

0.0072

0.0082

0.0092

b

0.234

0.260

0.312

0.0092

0.0102

0.0123

e

0.400

0.0157

s

0.235

0.255

0.275

0.0093

0.0100

0.0108

D

1.270

1.310

1.350

0.0500

0.0516

0.0531

E

1.670

1.710

1.750

0.0657

0.0673

0.0689

ECN: S13-2510-Rev. B, 16-Dec-13

DWG: 6017

s

e

s

e

e

b

E

FYWL

ABCDE

Index Bump A1

A1

B1

C1

A2

A3

A4

B2

B3

B4

C2

C3

C4

Top View

Bottom View

Side View

Bump Note 2

RECOMMENDED

LAND PATTERN

(NSMD)

e

e

A1

e