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TPS65013 Datasheet (HTML) - Texas Instruments

Part No. TPS65013
Description  POWER AND BATTERY MANAGEMENT IC FOR Li-ION POWERED SYSTEMS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
(1)
TPS65013
SLVS517 – AUGUST 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The serial interface can be used for dynamic voltage scaling, for collecting information on and controlling the
battery charger status, for optionally controlling 2 LED driver outputs, a vibrator driver, masking interrupts, or for
disabling/enabling and setting the LDO output voltages. The interface is compatible with the fast/standard mode
I2C™ specification allowing transfers at up to 400 kHz.
ORDERING INFORMATION
TA
PACKAGE
PART NUMBER(1)
-40
°C to 85°C
7 mm
× 7 mm, 48-pin QFN
TPS65013RGZ
(1)
The RGZ package is available in tape and reel. Add R suffix (TPS65013RGZR) to order quantities of
2500 parts per reel. Add T suffix (TPS65013RGZT) to order quantities of 250 parts per reel.
over operating free-air temperature range unless otherwise noted(1)
UNIT
Input voltage on VAC pin with respect to AGND
20 V
Input voltage range on all other pins except AGND/PGND pins with respect to AGND
-0.3 V to 7 V
HBM and CDM capabilities at pins VIB, PG, and LED2
1 kV
Current at AC, VBAT, VINMAIN, L1, PGND1
1800 mA
Peak current at all other pins
1000 mA
Continuous power dissipation
See Dissipation Rating Table
Operating free-air temperature, TA
-40
°C to 85°C
Maximum junction temperature, TJ
125
°C
Storage temperature, Tstg
-65
°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
260
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AMBIENT
MAX POWER DISSIPATION
DERATING FACTOR
TEMPERATURE
FOR Tj= 125°C
(2)
ABOVE TA= 55°C
25
°C
3 W
30 mW/
°C
55
°C
2.1 W
(1)
The TPS65013 is housed in a 48-pin QFN package with exposed leadframe on the underside. This 7
mm
× 7 mm package exhibits a thermal impedance (junction-to-ambient) of 33 K/W when mounted
on a JEDEC high-k board.
(2)
Consideration needs to be given to the maximum charge current when the assembled application
board exhibits a thermal impedance which differs significantly from the JEDEC high-k board.
2



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