9

1

2

3

14

5

10

6

8

6

12

11

13

7

Socket base pin A1

BGA pin A1

12.725

12.725

2.50

Insulation plate - Backing plate stack-up

1.75mm deep cutouts for the components

3.1500

ITEM

NO.

DESCRIPTION

Material

1

Compression Screw M6x1

Stainless Steel (18-8)

2

Socket Lid

7075-T6 Aluminum Alloy

3

#0-80 Shoulder Screw, 0.062" thread length

Stainless Steel (303)

6

Dowel Pin, 1/32" x 3/16", SS

Chrome Stainless Steel

5

GHz Socket Base 10mm IC 3mm Thk

7075-T6 Aluminum Alloy

6

Custom backing plate

7075-T6 Aluminum Alloy

7

#0-80 X .313 LG, SOC HD CAP SCREW, ALLOY

STL, BLK OXIDE

Alloy Steel

8

Custom insulation plate

Ultem 1000

9

customer's target PCB

FR4

10

customer's device

Material <not specified>

11

Ball guide 8.9x9.2mm 0.4mm pitch 19x20 array

Kapton Polyimide/Cirlex

12

IC guide for 8.9x9.2mm IC

Torlon 4203

13

SM interposer

SM elastomer

14

Compression Plate for 8.9x9.2mm IC

7075-T6 Aluminum Alloy

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SM-BGA 8.9x9.2mm 0.4mm pitch 19x20 array

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 12-17-2013

Material: Material <not specified>

Finish:

Weight: 7.03

SM-BGA-9044 Drawing

SCALE: 3.5:1

SHEET: 4 OF 5

ENG: E. Smolentseva

FILE: SM-BGA-9044 Dwg

DRAWN BY: M. Raske