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HSF-1-100-2700-K Datasheet(PDF) 1 Page - TT Electronics. |
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HSF-1-100-2700-K Datasheet(HTML) 1 Page - TT Electronics. |
1 / 4 page High Surge Film Surface Mount Metal GlazeTM HSF Series 150°C maximum operating temperature RoHS - compatible components available Up to triple the surge rating of the rugged CHP1 Replaces costly surface-mount wirewound resistors General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal GlazeTM thick film element fired at 1000°C to solid ceramic Solder over nickel barrier High temperature dielectric coating Electrical Data • 1 Watt and 1/2 Watt power rating • 150°C maximum operating temperature • RoHS - Compatible Components Available • Up to triple the surge rating of the rugged CHP1 • Replaces costly surface-mount wirewound resistors Industry Footprint Type Maximum Power Rating Working Voltage Resistance Range (Ω) Tolerance (±%) TCR (ppm/°C) Product Category 2512 HSF-1 1W @ 70°C 350 3612 HSF-2 2W @ 25°C 500 8R2, 22R, 300R 5R9, 6R8, 11R, 27R, 12R, 68R, 270R Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request. High Surge ±200 10 High Surge ±200 10 Environmental Data d o h t e M t s e T e g n a h C m u m i x a M s c i t s i r e t c a r a h C Temperature Coefficient As specified MIL-R-55342H Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260°C for 10 seconds) Solderability 95% min. coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Moisture Resistance ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) Life Test ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent) Terminal Adhesion Strength ±1% +0.01 ohm no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds Resistance to Board bending ±1% +0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds √ HSF High Surge Film Surface Mount Metal GlazeTM HSF-1 Series Issue October 2010 Sheet 1 of 4 1 1 Resistors Metal GlazeTM lm element red at 1000˚C to solid ceramic Solder over nickel barrier High temperature dielectric coating All Pb-free parts comply with EU Directive 2011/65/EU (RoHS2) 04.16 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com BI Technologies IRC Welwyn |
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