22.225±0.125

SOCKET SIZE

23.73

BACKING PLATE

5.08±0.03

19.725±0.050 (x4)

2.54±0.03

2.0625

2.3125*

1.61±0.05 THRU (4)

NON-PLATED MOUNTING HOLE

0.85±0.025 THRU (2)

NON-PLATED ALIGNMENT HOLE

0.65

0.33 TYP

PAD

15.6000 (x4)

7.5500

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Target PCB Recommendations

Total thickness: 1.6 mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. C

DATE: 10/25/2012

Material: N/A

Finish: N/A

Weight: 13.47

SG-BGA-7146 Drawing

SCALE: 2:1

SHEET: 2 OF 5

ENG: V. Panavala

FILE: SG-BGA-7146 Dwg

DRAWN BY: V. Panavala