146 CTI

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Vishay BCcomponents

Revision: 05-Dec-16

5

Document Number: 28403

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS



ACCORDING TO JEDEC J-STD-020

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

• Temperature measuring point on top of the case and on terminals.

• Max. 2 runs with pause of min. 30 min in between.

REFLOW SOLDERING CONDITIONS for MAL214699xxxE3

PROFILE FEATURES

CASE CODE

0810 TO 1012

CASE CODE

1213 TO 1216

CASE CODE

1616 TO 1821

300 s

300 s

300 s

Max. ramp-up rate to 150 °C

3 K/s

3 K/s

3 K/s

150 s

150 s

150 s

110 s

110 s

110 s

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

90 s

90 s

90 s

70 s

65 s

60 s

260 °C

250 °C

245 °C

40 s

30 s

30 s

3 K/s to 6 K/s

3 K/s to 6 K/s

3 K/s to 6 K/s

t

1

200

190

150

25

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4