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PA4341.561NLT Datasheet(PDF) 2 Page - Pulse A Technitrol Company

Part # PA4341.561NLT
Description  High Current Molded Power Inductor
Download  7 Pages
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Manufacturer  PULSE [Pulse A Technitrol Company]
Direct Link  http://www.pulseeng.com
Logo PULSE - Pulse A Technitrol Company

PA4341.561NLT Datasheet(HTML) 2 Page - Pulse A Technitrol Company

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P768.D (07/16)
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pulseelectronics.com
SMT Power Inductor
High Current Molded Power Inductor - PA4341.XXXNLT Series
Electrical Specifications @ 25°C - Operating Temperature -40°C to +125°C
Part
Number
Inductance
100KHz, 1V
Rated
Current
DC
Resistance
Saturation
Current
Max.
MAX.
TYP.
uH
A
m
m
A
PA4341.222NLT
2.2
±20%
8.0
20.0
18.0
14.0
PA4341.252NLT
2.5
±20%
7.0
22.0
20.0
13.0
PA4341.332NLT
3.3
±20%
6.0
30.0
28.0
13.5
PA4341.472NLT
4.7
±20%
5.5
40.0
37.0
10.0
PA4341.562NLT
5.6
±20%
5.0
48.0
43.0
9.0
PA4341.682NLT
6.8
±20%
4.5
60.0
54.0
8.0
PA4341.822NLT
8.2
±20%
4.0
68.0
64.0
7.5
PA4341.103NLT
10.0
±20%
3.5
85.0
75.0
6.0
PA4341.123NLT
12.0
±20%
3.3
93.0
81.0
5.5
PA4341.223NLT
22.0
±20%
2.0
190.0
165.0
35
PA4341.473NLT
47.0
±20%
1.75
363.0
302.0
2.0
1. Actual temperature of the component during system operation (ambient plus tempera-
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approximately
30% at the stated ambient temperature. This current is determined by placing the com-
ponent in the specified ambient environment and applying a short duration pulse cur-
rent (to eliminate self-heating effect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40�C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 125�C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all affect the part temperature. Part temperature should be verified in the
end application.
Notes:
PA4341.XXXNLT
Mechanical
Final Layout
SUGGESTED PAD LAYOUT


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