32.225±0.125 (x4)

socket base size

34.725±0.125 (x4)

backing plate size

2.8375*

2.4625

0.800 typ.

29.725±0.050 (x4)

5.080

2.540

1.250

2.500

1.250

2.500

14.8625 (x8)

1.710±0.100 (x4)

Non-plated mounting hole

0.850±0.050 (x2)

Non-plated alignment hole

0.420 pad (x1024)

2.0875*

Orientation mark

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Steel backing plate may be required based on end user's application

(for full array)

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 06/18/2015

Material: N/A

Finish: N/A

Weight: 46.16

SG-BGA-6429 Drawing

SCALE: 3:1

SHEET: 2 OF 4

ENG: S. Huang

FILE: SG-BGA-6429 Dwg

DRAWN BY: M. Raske