0.8mm typ.

12.8mm square [0.504"]

16mm

[0.630"]

16mm [0.630"]

1.2mm [0.047"]

1.2mm

[0.047"]

4.55mm

[0.179"]

0.36mm ± 0.05mm

[0.014" ± 0.002"]

0.2mm dia.

[0.008"]

Status: Released

Drawing: A. Evans

Scale: 6:1

Rev: B

Date: 5/27/09

Modified: 09/02/14

File: SF-BGA224B-B-61F Dwg.mcd

SF-BGA224B-B-61F Drawing

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material;

Non-clad

2

1

1

2

Top View

Side View

Description: Giga-snaP BGA SMT Foot

224 position terminal pins (0.8mm centers) to SMT solder balls (BGA type). Pin asignment 1:1.

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

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