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SG-BGA-6309 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6309 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 3 page Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View BGA IC Size Pitch Array 16x16mm 0.8mm 19x19 Page 2 of 3 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Status: Released Drawing: M. A. Fedde Scale: 4:1 Rev: A Date: 09/23/2014 Modified: File: SG-BGA-6309 Dwg.mcd SG-BGA-6309 Drawing © 2008 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com non plated Mounting Hole non plated Alignment Hole Orientation Mark 1.25mm±0.13mm (x4) 1.25mm±0.13mm (x4) 21.225mm±0.125mm(x4) 5.08mm 18.725mm (x4) 0.80mm typ. Ø 1.61mm±0.05mm (x4) Ø 0.85mm±0.03mm (x2) Ø 0.360mmxPAD 2.5375mm* Socket size 2.54mm * Note: BGA pattern is not symmetrical with respect to the mounting holes. 14.40mm 14.40mm 2.1625mm D X DETAIL TOP VIEW SIDE VIEW Compatible BGA Spec |
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